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W25X10A, W25X20A, W25X40A, W25X80A
11.7 AC Electrical Characteristics ( cont’d)
DESCRIPTION
/HOLD Active Setup Time relative to CLK
/HOLD Active Hold Time relative to CLK
/HOLD Not Active Setup Time relative to CLK
/HOLD Not Active Hold Time relative to CLK
SYMBOL
t HLCH
t CHHH
t HHCH
t CHHL
ALT
MIN
5
5
5
5
SPEC
TYP
MAX
UNIT
ns
ns
ns
ns
/HOLD to Output Low-Z
/HOLD to Output High-Z
Write Protect Setup Time Before /CS Low
Write Protect Hold Time After /CS High
/CS High to Power-down Mode
/CS High to Standby Mode without Electronic
t HHQX (2)
t HLQZ (2)
t WHSL (3)
t SHWL (3)
t DP (2)
t RES 1 (2)
t LZ
t HZ
20
100
7
12
3
3
ns
ns
ns
ns
μs
μs
Signature Read
/CS High to Standby Mode with Electronic
t RES 2 (2)
1.8
μs
Signature Read
Write Status Register Time
Byte Program Time (First Byte) (5)
Additional Byte Program Time (After First Byte) (5)
Page Program Time
Sector Erase Time (4KB)
Block Erase Time (64KB)
Chip Erase Time W25X10A / W25X20A
Chip Erase Time W25X40A
Chip Erase Time W25X80A
t W
t BP1
t BP2
t PP
t SE
t BE
t CE
10
30
6
1.5
120
0.4
1.5
3
6
15
50
12
3
250
1
3
5
10
ms
μs
μs
ms
ms
s
s
s
s
Notes:
1.
2.
3.
4.
5.
Clock high + Clock low must be less than or equal to 1/f C .
Value guaranteed by design and/or characterization, not 100% tested in production.
Only applicable as a constraint for a Write Status Register instruction when Sector Protect Bit is set to 1.
Commercial temperature only applies to Fast Read (F R1 ). Industrial temperature applies to all other parameters.
For multiple bytes after first byte within a page, t BPN = t BP1 + t BP2 * N (typical) and t BPN = t BP1 + t BP2 * N (max), where
N = number of bytes programmed.
- 36 -
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